Threaded cooling apparatus with integrated cooling channels and heat exchanger

ABSTRACT

A threaded cooling apparatus includes a head having a heat exchanger and a shaft having a threaded section configured to mechanically fasten the head to a structure. The heat exchanger is configured to exchange heat with a coolant flowing through the head. The shaft also includes first and second cooling channels. The first cooling channel is configured to deliver the coolant to the heat exchanger, and the second cooling channel is configured to exhaust the coolant from the heat exchanger. The apparatus may also include a first seal between the head and the structure that is configured to reduce or prevent coolant loss. The apparatus may further include a second seal that is configured to reduce or prevent coolant flow between the first and second cooling channels that bypasses the heat exchanger.

GOVERNMENT LICENSE RIGHTS

This invention was made with U.S. government support under Contract No.FA8650-04-G-0002-0001 awarded by the U.S. Department of Defense. TheU.S. government may have certain rights in the invention.

TECHNICAL FIELD

This disclosure is generally directed to cooling systems. Morespecifically, this disclosure relates to a threaded cooling apparatuswith integrated cooling channels and heat exchanger.

BACKGROUND

Electronic devices routinely require mechanisms for rejecting ortransferring heat away from electronic components. Many electronicdevices are designed to reject heat through the tops of their packaging.Due to mechanical assembly tolerances and design differences, however,different components often have surfaces that vary with respect to oneanother and from device to device. Any cooling system designed to mateto the top surfaces of an array of components often needs to accommodatevertical height variations among those components.

Different cooling systems have used various approaches to transfer heataway from electronic components, but these approaches have variousshortcomings. A first approach includes mounting electronic componentsdirectly on a flat heat exchanger. However, it is typically impracticalto mount all components on a single heat exchanger. Also, a flat heatexchanger covering multiple heat sources is typically a monolithicassembly of a single material, where a heat exchanger element is notseparable from the larger assembly. As a result, if one heat exchangerelement becomes fouled or clogged, the whole assembly often must bereplaced. Additionally, if a particular material is required in the heatexchanger element for efficient heat exchange, the complete assemblyoften needs to be manufactured with the same material, which can resultin greater cost, greater weight, and lower overall heat exchangeefficiency.

A second approach involves mounting a heat exchanger on an electroniccomponent and plumbing the heat exchanger with flexible coolant lines.However, mounting multiple heat exchangers on multiple componentstypically requires many fluidic couplings, which often is impracticalfor assembly and is susceptible to leaks. Moreover, fluidic couplingsare often different mechanisms from mechanical fasteners that providemechanical coupling of a heat exchanger to a larger assembly. The designand installation complexity of heat exchanger elements increasesproportionally with the number of mechanical and fluid interconnects. Athird approach includes conducting heat away from electronic componentsthrough a conforming thermal interface material, but these materialsoften experience very large temperature gradients. A fourth approachinvolves deflecting flexible cooling elements to engage electroniccomponents, but flexible cooling elements often require large amounts ofspace, thereby limiting the pitch or density of the electroniccomponents.

SUMMARY

This disclosure provides a threaded cooling apparatus with integratedcooling channels and heat exchanger.

In a first embodiment, a threaded cooling apparatus includes a headhaving a heat exchanger and a shaft having a threaded section configuredto mechanically fasten the head to a structure. The heat exchanger isconfigured to exchange heat with a coolant flowing through the head. Theshaft also includes first and second cooling channels. The first coolingchannel is configured to deliver the coolant to the heat exchanger, andthe second cooling channel is configured to exhaust the coolant from theheat exchanger.

In a second embodiment, a system includes a threaded cooling apparatusand a manifold. The threaded cooling apparatus includes a head having aheat exchanger and a shaft having a threaded section. The heat exchangeris configured to exchange heat with a coolant flowing through the head.The shaft also includes first and second cooling channels, where thefirst cooling channel is configured to deliver the coolant to the heatexchanger and the second cooling channel is configured to exhaust thecoolant from the heat exchanger. The manifold includes first and secondcoolant channels. The first coolant channel is configured to provide thecoolant to the first cooling channel of the threaded cooling apparatus,and the second coolant channel is configured to return the coolant fromthe second cooling channel of the threaded cooling apparatus. Thethreaded section is configured to mechanically fasten the head to themanifold.

In a third embodiment, a method includes inserting a threaded coolingapparatus into a structure, where the threaded cooling apparatusincludes a head and a shaft. The head includes a heat exchanger, and theshaft includes a threaded section configured to mechanically fasten thehead to the structure. The method also includes providing coolant to theheat exchanger through a first cooling channel in the shaft, where theheat exchanger is configured to exchange heat with the coolant flowingthrough the head. The method further includes exhausting the coolantfrom the heat exchanger through a second cooling channel in the shaft.

Other technical features may be readily apparent to one skilled in theart from the following figures, descriptions, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of this disclosure and its features,reference is now made to the following description, taken in conjunctionwith the accompanying drawings, in which:

FIGS. 1A and 1B illustrate a first example threaded cooling apparatuswith integrated cooling channels and heat exchanger in accordance withthis disclosure;

FIGS. 2A and 2B illustrate an example mechanical and fluid coupling ofthe threaded cooling apparatus of FIGS. 1A and 1B in accordance withthis disclosure;

FIGS. 3A and 3B illustrate a second example threaded cooling apparatuswith integrated cooling channels and heat exchanger in accordance withthis disclosure;

FIG. 4 illustrates a third example threaded cooling apparatus withintegrated cooling channels and heat exchanger in accordance with thisdisclosure;

FIG. 5 illustrates a fourth example threaded cooling apparatus withintegrated cooling channels and heat exchanger in accordance with thisdisclosure;

FIGS. 6A through 6C illustrate a fifth example threaded coolingapparatus with integrated cooling channels and heat exchanger inaccordance with this disclosure;

FIG. 7 illustrates an example system having multiple threaded coolingapparatuses with integrated cooling channels and heat exchangers inaccordance with this disclosure; and

FIG. 8 illustrates an example method for cooling one or more componentsusing a threaded cooling apparatus with integrated cooling channels andheat exchanger in accordance with this disclosure.

DETAILED DESCRIPTION

FIGS. 1 through 8, described below, and the various embodiments used todescribe the principles of the present invention in this patent documentare by way of illustration only and should not be construed in any wayto limit the scope of the invention. Those skilled in the art willunderstand that the principles of the present invention may beimplemented in any type of suitably arranged device or system.

FIGS. 1A and 1B illustrate a first example threaded cooling apparatus100 with integrated cooling channels and heat exchanger in accordancewith this disclosure. As shown in FIG. 1A, the apparatus 100 has theform of a bolt with a head 102 and a threaded section 104. The head 102generally represents any suitable structure that can be turned toscrew/unscrew the threaded section 104 into another structure. In thisexample, the head 102 represents a hexagonal bolt head. However, thehead 102 could represent any other suitable structure that is capable ofcontaining a heat exchanger (described below). The head 102 could alsosupport other mechanisms for turning the apparatus 100, such as a screwhead. The head 102 could be formed from any suitable material(s) and inany suitable manner, and the method of manufacturing can affect thematerials used (or vice versa).

The threaded section 104 represents a portion of the apparatus 100 thatincludes a thread wrapped helically around a central shaft 106, which isconnected to the head 102. The threaded section 104 helps to couple theapparatus 100 to a larger device or system, such as by engaging athreaded receptacle in the larger device or system. The threaded section104 could include a thread having any suitable thread size and threadsper inch. The threaded section 104 could be formed from any suitablematerial(s) and in any suitable manner. The threaded section 104 may ormay not be formed from the same material(s) as the head 102. Also, whileshown as having a cylindrical cross-section, the shaft 106 of theapparatus 100 could have any other suitable cross-sectional shape.

In this example, the threaded section 104 extends along the shaft 106from the head 102 of the apparatus 100 down to a flow restrictor 108.The flow restrictor 108 represents a circular or other structure aroundthe shaft 106. As described below, the flow restrictor 108 helps torestrict bypass flow of coolant between cooling channels in theapparatus 100.

As shown in FIG. 1B, the apparatus 100 includes multiple coolingchannels through at least a portion of the shaft 106. A cooling channel110 is formed through the shaft 106 of the apparatus 100, and coolingchannels 112 a-112 b are formed through or near the threaded section 104of the apparatus 100. The cooling channels 110, 112 a-112 b support theflow of coolant (such as a liquid or gas) to and from a heat exchanger114 within the head 102 of the apparatus 100. In some embodiments, thecooling channel 110 provides coolant to the heat exchanger 114, and thecooling channels 112 a-112 b exhaust returned coolant that hasinteracted with the heat exchanger 114. Coolant flow could also bereversed depending on the implementation.

Each cooling channel 110, 112 a-112 b represents any suitable path forcoolant through at least part of the shaft 106 of the apparatus 100. Inthis example, the cooling channel 110 extends the entire length of theshaft 106 from the location where the head 102 joins the shaft 106 tothe bottom of the shaft 106. Also, each cooling channel 112 a-112 b hereis shown as residing between the threaded section 104 and the centralshaft 106 of the apparatus 100. However, the cooling channels 112 a-112b could be formed in other ways. For instance, the cooling channels 112a-112 b could be formed as grooves or other paths through the threadedsection 104, so the thread in the threaded section 104 is not continuousbut is instead divided in locations where the cooling channels 112 a-112b are present.

Each of the cooling channels 110, 112 a-112 b could also be formed inany suitable manner. For example, the cooling channel 110 could beformed by drilling or otherwise forming an opening through the shaft 106of the apparatus 100. The cooling channels 112 a-112 b could be formedby machining or otherwise forming a path through or under the threadedsection 104 of the apparatus 100.

The heat exchanger 114 could include any suitable heat exchangingelements. For example, the heat exchanger 114 could contain extendedsurfaces (fins), such as straight, wavy, or offset fins. The fins couldbe stamped, perforated, or machined. A porous medium could be used inthe heat exchanger 114 without fins. The heat exchanger 114 couldinclude straight or radial channels. The heat exchanger 114 could havemultiple levels of coolant plumbing, such as a lower chamber and anupper chamber separated by small openings to supply and return coolantfrom one chamber to the other. The heat exchanger 114 could support jetimpingement cooling, single-phase cooling, or multi-phase cooling. Theheat exchanger 114 could contain a phase-change material (such asparaffin) that remains within the heat exchanger 114, while coolantcould run through another portion of the heat exchanger 114. Anycombination of these or other features could also be used in the heatexchanger 114.

The heat exchanger 114 and the apparatus 100 in general could be formedfrom any suitable material(s). Example materials include aluminum or analuminum alloy (such as 6061-T6), titanium, copper, a copper-basedmatrix composite (such as GLIDCOP), a nickel-iron alloy (such as INVAR),steel, or stainless steel.

In addition, the apparatus 100 could be formed in any suitable manner.Example techniques include brazing, welding (such as friction welding),diffusion bonding, soldering, polymeric bonding, additive manufacturing,machining, and stamping. The heat exchanger 114 and the shaft 106 may befabricated from the same piece of material or as separate pieces. Ifseparate pieces are used, the pieces may be mechanically coupled, suchas by using any of the processes above or by threading one end of theshaft 106 into a receptacle in the heat exchanger 114.

As a particular manufacturing example, the head 102 of a fabricated boltcan be machined to form a cavity for the heat exchanger 114, andchannels in the shaft 106 of the bolt can be machined to form thecooling channels. Machining can be performed to create connectionsbetween the bolt head and the shaft's channels, a fin core can be placedinto the cavity in the bolt head 102, and a cap can be brazed onto thebolt head 102.

As another particular manufacturing example, thin foils of metal (suchas those about 0.004 inches thick) could be etched with a desiredpattern, and the foils can be joined using diffusion bonding. Wireelectrical discharge machining (EDM) or other machining can be used tocreate a part with no external features, and machining can occur tocreate external features like helical grooves and coolant channels.

As a third particular manufacturing example, additive manufacturing(also known as “3D printing”) can be used to create the main structure,and helical grooves in the shaft can be created during the additivemanufacturing process or after the additive manufacturing process iscomplete (such as by machining the resulting structure).

As a fourth particular manufacturing example, a heat exchanger 114 canbe fabricated in the head 102 having a single supply/return coolantreceptacle with helical grooves. A threaded shaft 106 can be fabricatedwith helical grooves to mate with the head 102 on one end and helicalgrooves to mate with another structure on the opposite end. The threadedshaft 106 can be inserted into the head 102.

In this way, the apparatus 100 integrates a threaded shaft havingcoolant channels with a high-performance cooling mechanism to create amodularized heat exchanger with all mechanical and fluidic connectionscombined into a single device. The modularized heat exchanger can beeasily installed in a larger device or system using a single threadedconnection, possibly creating an array of heat exchanger elements, andeach modularized heat exchanger can be easily replaced by simplyexchanging one threaded apparatus with another threaded apparatus (notnecessarily with the same size of heat exchanger). Among other things,this can help to reduce repair costs associated with the apparatus 100or the larger device/system. The apparatus 100 also provides coolingcapabilities in a small package by integrating a heat exchanger andcoolant supply/return lines in a single assembly. Moreover, as describedbelow, because the apparatus 100 is threaded, the apparatus 100 isheight adjustable, which can help to reduce or eliminate toleranceissues when component heights vary and can provide a fine pitch-scalablesolution. Further, the apparatus 100 can be used to help reduce hardwaretemperatures with a “conforming” heat exchanger element that translatesperpendicular to the surface of a coolant manifold. Beyond that, theapparatus 100 allows the heat exchanger to be placed in close proximityto a heat source to be cooled, reducing parasitic temperature rises. Inaddition, the apparatus 100 can be manufactured in a wide variety ofsizes to accommodate various devices to be cooled, such as semiconductorelements of various sizes and packaging densities.

The apparatus 100 could also be used in a wide range of applications.For example, the apparatus 100 may be used to reject heat from a heatsource into a coolant or to reject heat from the coolant into a heatsink. Example applications include automotive, aerospace, andelectronics cooling. As particular examples, the apparatus 100 could beused to reject heat from a single semiconductor element or an array ofsemiconductor elements in an electronic assembly. For instance, theapparatus 100 could be inserted into a coolant manifold, and the head102 of the apparatus 100 could be placed on or near one or moresemiconductor elements. Heat from the semiconductor elements istransferred to the coolant flowing through the cooling channels 110, 112a-112 b via the heat exchanger 114. The apparatus 100 could also be usedin coolant or hydraulic lines where miniature non-integral heatexchanger elements are needed or to reject heat from the hydraulicfluid. Other example uses can include rejecting heat from laser diodes,power transformers, power electronics, combustion chambers or assemblieswith combustion chambers (such as automotive combustion engines,turbines, or rocket engines), or any other application where one wouldwish to transfer heat into or out of a coolant. The apparatus 100 couldfurther be used in installations where clogging, fouling, or corrosionof a heat exchanger is frequent, necessitating frequent replacement ofthe heat exchanger. In addition, the apparatus 100 could be used inapplications where composite/polymer manifold structures are used. Notethat the apparatus 100 need not be used as a mechanical fastener,meaning it is not used to mechanically couple components in a securemanner. As a result, the apparatus 100 need not have the same strengthor be capable of handling the same torque as conventional bolts(although it could depending on the design, composition, andmanufacture).

Although FIGS. 1A and 1B illustrate a first example of a threadedcooling apparatus 100 with integrated cooling channels and heatexchanger, various changes may be made to FIGS. 1A and 1B. For example,the apparatus 100 is shown here as having the form of a bolt. However,the apparatus 100 could be implemented using any other suitablefastener, and the overall apparatus may or may not resemble a standardtype of fastener (such as when the head 102 does not fit within a socketwrench). Also, any number of cooling channels within the apparatus 100could be used to supply coolant to the heat exchanger 114, and anynumber of cooling channels within the apparatus 100 could be used toexhaust returned coolant from the heat exchanger 114.

FIGS. 2A and 2B illustrate an example mechanical and fluid coupling ofthe threaded cooling apparatus 100 of FIGS. 1A and 1B in accordance withthis disclosure. As shown in FIG. 2A, the apparatus 100 has beeninserted into a manifold 200 having multiple coolant channels 202 and204. The manifold 200 represents any suitable structure that deliverscoolant to and returns coolant from a threaded cooling apparatus. Forexample, the manifold 200 could represent a portion of a coldplate, andone or multiple threaded cooling apparatuses 100 could be inserted intothe coldplate. The manifold 200 could be formed from any suitablematerial(s) and in any suitable manner.

As shown in FIG. 2B, the coolant channel 202 in the manifold 200 candeliver coolant to the apparatus 100, and the coolant flows into theapparatus 100 through the cooling channel 110. The coolant reaches theheat exchanger 114 in the head 102 of the apparatus 100, which exchangesheat with the coolant. The coolant then flows through the coolingchannels 112 a-112 b to the coolant channel 204 in the manifold 200. Asnoted above, however, the flow of coolant could be reversed.

As shown in FIGS. 2A and 2B, seals 206 and 208 help limit coolant flowaround or out of the apparatus 100. In this example, the seal 206 helpsto reduce or prevent coolant from flowing around the apparatus 100 andout of the manifold 200 into the ambient environment. In contrast, theseal 208 helps to reduce or prevent coolant flow between the channels202 and 204 in the manifold 200 that bypasses the heat exchanger 114.The flow restrictor 108 can similarly help to reduce or prevent coolantflow between the channels 202 and 204 in the manifold 200 that bypassesthe heat exchanger 114. For example, the flow restrictor 108 can applycompressive pressure on the seal 208 to improve sealing. The seals 206and 208 may be replaceable and available in different sizes toaccommodate different height adjustments of apparatus 100.

Each seal 206 and 208 represents any suitable structure for helping toreduce or prevent coolant flow in specified areas, such as rubber orother O-rings. In some embodiments, the seal 206 can withstand largerpressure differentials than the seal 208. In particular embodiments, theseal 206 can withstand pressure differentials of about 50 pounds persquare inch (psi) or more, while the seal 208 can withstand pressuredifferentials of about 10 pounds psi or less. Once again, as notedabove, the apparatus 100 need not be used as a mechanical fastener, sothe apparatus 100 need not have the same strength or be capable ofhandling the same torque as conventional bolts (although it could).

Note that in this example, the seals 206 and 208 are compressible. As aresult, the apparatus 100 can be raised or lowered by small amountswithin the manifold 200 while still allowing the seals 206 and 208 toreduce or prevent coolant leakage. This allows the apparatus 100 to varyin height relative to the surface of the manifold 200 (or other surfaceinto which the apparatus 100 is inserted). In particular embodiments,the height of the apparatus 100 could vary by a distance of about ±0.01inches (±0.254 mm), although the precision of this value could varydepending on the pitch of the threads in the threaded section 104. Whenmultiple apparatuses 100 are inserted into the same structure like acoldplate, the height of each apparatus 100 could vary independentlyfrom the others, which allows the apparatuses 100 to conform to theheights of various heat sources (such as semiconductor chips). This alsohelps to reduce or eliminate the need for using thermal gap filler padsto absorb mechanical tolerances, which can be beneficial since gapfiller pads typically have poor thermal performance. This further helpsto avoid the use of materials that experience large temperaturegradients and can increase the pitch or density of cooled componentssince flexible manifolds are not needed (although these could still beused with the apparatus 100). Furthermore, the seals 206 and 208 can bereplaceable, and the thickness and the material of each seal can becustomizable.

Although FIGS. 2A and 2B illustrate one example mechanical and fluidcoupling of the threaded cooling apparatus 100 of FIGS. 1A and 1B,various changes may be made to FIGS. 2A and 2B. For example, as notedabove, the apparatus 100 could include a single cooling channel 112 a or112 b for exhausting returned coolant from the heat exchanger 114. Also,the apparatus 100 could be used in any other suitable structure.

FIGS. 3A and 3B illustrate a second example threaded cooling apparatus300 with integrated cooling channels and heat exchanger in accordancewith this disclosure. As shown in FIG. 3A, the apparatus 300 has beeninserted into the manifold of FIGS. 2A and 2B. Here, the apparatus 300includes a head 302 and a threaded section 304, and the head 302includes a heat exchanger 314. These components may be the same as orsimilar to corresponding components described above and could be formedfrom the same or similar materials and in the same or similar manner.

A cooling channel 310 provides coolant to the heat exchanger 314, and acooling channel 312 exhausts returned coolant from the heat exchanger314 (although the coolant flows could be reversed). A seal 316 islocated between the head 302 of the apparatus 300 and the manifold orother structure to help prevent coolant from flowing around theapparatus 300 into the ambient environment. The apparatus 300 does notinclude a flow restrictor (such as flow restrictor 108), which canreduce or eliminate the need for a second seal in the apparatus 300.Instead, the lower threaded area of the threaded section 304 could helpto limit coolant flow between the coolant channels 202 and 204 of themanifold. Due to mechanical tolerances, it may be impractical to useboth a lower threaded area and an upper threaded area in the threadedsection 304. In some circumstances, only the lower area of the threadedsection 304 may be threaded, and the upper area of the threaded section304 may not contain threads.

FIG. 3B illustrates an example way for implementing the cooling channel312 in the apparatus 300. As shown in FIG. 3B, the cooling channel 312is formed as a groove in the side of the threaded section 304. Thegroove splits the thread in the threaded section 304, which still allowsthe apparatus 300 to be inserted into a threaded receptacle whileallowing coolant flow through the groove. Of course, the cooling channel312 could be implemented in any other suitable manner, such as by notadding threads to the upper area of the threaded section 304.

FIG. 4 illustrates a third example threaded cooling apparatus 400 withintegrated cooling channels and heat exchanger in accordance with thisdisclosure. As shown in FIG. 4, the apparatus 400 has been inserted intothe manifold of FIGS. 2A and 2B. Here, the apparatus 400 includes a head402 and a threaded section 404, and the head 402 includes a heatexchanger 414. Cooling channels 410-412 provide coolant to and exhaustreturned coolant from the heat exchanger 414. A seal 416 is locatedbetween the head 402 and the manifold or other structure. Thesecomponents may be the same as or similar to corresponding componentsdescribed above and could be formed from the same or similar materialsand in the same or similar manner. However, in this example, the coolingchannel 410 forms an angle and exits the apparatus 400 along the siderather than on bottom. Due to mechanical tolerances, it may beimpractical to use a combination of a lower threaded area, a middlethreaded area, and an upper threaded area in the threaded section 404.In some circumstances, only the middle area of the threaded section 404may be threaded, and the upper and lower areas of the threaded section404 may not contain threads.

FIG. 5 illustrates a fourth example threaded cooling apparatus 500 withintegrated cooling channels and heat exchanger in accordance with thisdisclosure. As shown in FIG. 5, the apparatus 500 has been inserted intothe manifold of FIGS. 2A and 2B. Here, the apparatus 500 includes a head502 and a threaded section 504, and the head 502 includes a heatexchanger 514. Cooling channels 510-512 provide coolant to and exhaustreturned coolant from the heat exchanger 514. A seal 516 is locatedbetween the head 502 and the manifold or other structure, and a seal 518is located between the coolant channels 202-204 of the manifold. Thecooling channel 510 forms an angle and exits the apparatus 500 along theside rather than on bottom. In this example, the threaded section 504contains a helical thread only near the bottom of the apparatus 500.

In these figures, the apparatuses 300-500 are shown as having the formof bolts. However, an apparatus having integrated cooling channels and aheat exchanger could be implemented using any other suitable fastener,including non-standard fasteners. FIGS. 6A through 6C illustrate a fifthexample threaded cooling apparatus 600 with integrated cooling channelsand heat exchanger in accordance with this disclosure. In this example,the apparatus 600 includes a head 602 and a threaded section 604. Acooling channel 610 can be used to deliver coolant to a heat exchanger614 in the head 602, and one or more cooling channels 612 a-612 b couldexhaust coolant from the heat exchanger 614. FIG. 6B illustrates theapparatus 600 with a top of the head 602 removed to reveal the heatexchanger 614. Various seals are omitted here for simplicity.

In this example, the apparatus 600 represents a non-standard fastenerwith a rectangular head, although other shapes (including standardhexagonal shapes) could be used. Moreover, the head 602 is much largerthan those shown in earlier figures. Among other things, this can enablethe use of a larger heat exchanger within the apparatus.

Although FIGS. 3A through 6C illustrate additional examples of threadedcooling apparatuses with integrated cooling channels and heat exchanger,various changes may be made to FIGS. 3A through 6C. For example, anynumber of cooling channels within an apparatus could be used to supplycoolant to a heat exchanger, and any number of cooling channels withinan apparatus could be used to exhaust returned coolant from a heatexchanger. Also, note that various features from different figures couldbe combined as needed or desired. Features shown in one or more of theapparatuses described above could be used in other apparatuses describedabove.

As can be seen in the figures described above, there are a variety ofconfigurations for plumbing coolant through or across a threadedfastener to a heat exchanger within a head of the threaded fastener. Ingeneral, any fastener that includes a heat exchanger integrated into ahead of the fastener and multiple cooling channels for coolant flow toand from the heat exchanger falls within the scope of this disclosure.Also, note that any suitable technique can be used to adjust the heightof an apparatus over a manifold or other structure into which theapparatus is inserted, including rotation of the apparatus.

FIG. 7 illustrates an example system 700 having multiple threadedcooling apparatuses with integrated cooling channels and heat exchangersin accordance with this disclosure. As shown in FIG. 7, the system 700includes an electronic assembly 702 having a substrate 704 and multipleintegrated circuit chips 706. The substrate 704 represents any suitablestructure configured to carry and support integrated circuit chips, suchas a printed circuit board. The integrated circuit chips 706 representany suitable semiconductor chips, which can be configured to support anydesired functionality. In particular embodiments, the electronicassembly 702 could represent a computer motherboard, a ball grid array(BGA), or other structure containing multiple chips. As shown here,different integrated circuit chips 706 can have different lengths,widths, and/or heights (although this need not be the case).

The system 700 also includes a cooling system 708 having a manifold 710and multiple threaded cooling apparatuses 712. The manifold 710 isconfigured to deliver coolant to and receive coolant from the threadedcooling apparatuses 712. The threaded cooling apparatuses 712 thermallycouple to the integrated circuit chips 706 in the electronic assembly702 and remove heat away from the integrated circuit chips 706. Eachthreaded cooling apparatus 712 could include any suitable fastener thatincludes a heat exchanger integrated into a head of the fastener andmultiple cooling channels for coolant flow to and from the heatexchanger (such as any of the devices described above). Each threadedcooling apparatus 712 could be individually adjusted in height in orderto contact and effectively remove heat from the associated integratedcircuit chip(s) 706.

Although FIG. 7 illustrates one example of a system 700 having multiplethreaded cooling apparatuses with integrated cooling channels and heatexchangers, various changes may be made to FIG. 7. For example, thesystem 700 could include any number of electronic assemblies 702 andcooling systems 708. Also, the electronic assembly 702 could include anynumber of substrates 704 and integrated circuit chips 706, and thecooling system 708 could include any number of manifolds 710 andthreaded cooling apparatuses 712. In addition, while shown as having aone-to-one relationship between the integrated circuit chips 706 and thethreaded cooling apparatuses 712, this need not be the case. Forinstance, a single threaded cooling apparatus 712 could thermally coupleto multiple integrated circuit chips 706.

FIG. 8 illustrates an example method 800 for cooling one or morecomponents using a threaded cooling apparatus with integrated coolingchannels and heat exchanger in accordance with this disclosure. For easeof explanation, the method 800 is described as involving the use of theapparatus 100 connected to the manifold 200. However, the method 800could involve the use of any other suitable threaded cooling apparatus(such as those described above) in any suitable larger structure.

As shown in FIG. 8, a threaded cooling apparatus is inserted into astructure that provides coolant at step 802. This could include, forexample, inserting the apparatus 100 into the manifold 200. The heightof the apparatus is adjusted as needed at step 804. This could include,for example, rotating the apparatus 100 or taking other suitable actionso that the top surface of the apparatus 100 is at a desired heightabove the manifold 200. The desired height could be based, for example,on a device or system to be cooled using the apparatus 100, such as theheight of one or more semiconductor chips.

Coolant is supplied to the apparatus through a first channel at step806, and the coolant is supplied to a heat exchanger within theapparatus at step 808. This could include, for example, receivingcoolant at the heat exchanger 114 from the manifold 200 through thecooling channel 110. This could also include exchanging heat with thecoolant at the heat exchanger 114. In this way, the apparatus helps toprovide cooling to or rejects heat to an external device or system atstep 810. This could include, for example, transferring heat away fromthe external device or system into the coolant via the heat exchanger114. This could alternatively include transferring heat to the externaldevice or system from the coolant via the heat exchanger 114. Thecoolant is returned to the structure at step 812. This could include,for example, exhausting returned coolant to the manifold 200 through thecooling channel(s) 112 a-112 b.

Although FIG. 8 illustrates one example of a method 800 for cooling oneor more components using a threaded cooling apparatus with integratedcooling channels and heat exchanger, various changes may be made to FIG.8. For example, the method 800 could involve the use of multiplethreaded apparatuses, such as multiple apparatuses inserted into acoldplate, and those multiple threaded apparatuses may or may not beidentical. Also, while shown as a series of steps, various steps in FIG.8 could overlap, occur in parallel, or occur multiple times.

It may be advantageous to set forth definitions of certain words andphrases used throughout this patent document. The terms “include” and“comprise,” as well as derivatives thereof, mean inclusion withoutlimitation. The term “or” is inclusive, meaning and/or. The phrase“associated with,” as well as derivatives thereof, may mean to include,be included within, interconnect with, contain, be contained within,connect to or with, couple to or with, be communicable with, cooperatewith, interleave, juxtapose, be proximate to, be bound to or with, have,have a property of, have a relationship to or with, or the like. Thephrase “at least one of,” when used with a list of items, means thatdifferent combinations of one or more of the listed items may be used,and only one item in the list may be needed. For example, “at least oneof: A, B, and C” includes any of the following combinations: A, B, C, Aand B, A and C, B and C, and A and B and C.

While this disclosure has described certain embodiments and generallyassociated methods, alterations and permutations of these embodimentsand methods will be apparent to those skilled in the art. Accordingly,the above description of example embodiments does not define orconstrain this disclosure. Other changes, substitutions, and alterationsare also possible without departing from the spirit and scope of thisdisclosure, as defined by the following claims.

What is claimed is:
 1. A threaded cooling apparatus comprising: a headcomprising a heat exchanger; and a shaft comprising a threaded sectionconfigured to mechanically fasten the head to a structure; wherein theheat exchanger is configured to exchange heat with a coolant flowingthrough the head; and wherein the shaft further comprises first andsecond cooling channels, the first cooling channel configured to deliverthe coolant to the heat exchanger, the second cooling channel configuredto exhaust the coolant from the heat exchanger.
 2. The apparatus ofclaim 1, wherein the heat exchanger is configured to translateperpendicular to a surface of the structure based on rotation of theapparatus.
 3. The apparatus of claim 1, further comprising: a first sealbetween the head and the structure, the first seal configured to reduceor prevent coolant loss.
 4. The apparatus of claim 3, furthercomprising: a second seal configured to reduce or prevent coolant flowbetween the first and second cooling channels that bypasses the heatexchanger.
 5. The apparatus of claim 1, wherein the head and the shaftform a bolt.
 6. The apparatus of claim 1, wherein the first coolingchannel extends along an entire length of the shaft.
 7. The apparatus ofclaim 1, wherein the first cooling channel extends along part but notall of a length of the shaft and is angled so that an entry to the firstcooling channel is located along a side of the shaft.
 8. The apparatusof claim 1, wherein the second cooling channel comprises a groovethrough at least part of the shaft.
 9. A system comprising: a threadedcooling apparatus comprising: a head comprising a heat exchanger; and ashaft comprising a threaded section; wherein the heat exchanger isconfigured to exchange heat with a coolant flowing through the head; andwherein the shaft further comprises first and second cooling channels,the first cooling channel configured to deliver the coolant to the heatexchanger, the second cooling channel configured to exhaust the coolantfrom the heat exchanger; a manifold comprising first and second coolantchannels, the first coolant channel configured to provide the coolant tothe first cooling channel of the threaded cooling apparatus, the secondcoolant channel configured to return the coolant from the second coolingchannel of the threaded cooling apparatus; wherein the threaded sectionis configured to mechanically fasten the head to the manifold.
 10. Thesystem of claim 9, wherein the heat exchanger is configured to translateperpendicular to a surface of the manifold based on rotation of thethreaded cooling apparatus.
 11. The system of claim 9, wherein thethreaded cooling apparatus further comprises a first seal between thehead and the manifold, the first seal configured to reduce or preventcoolant loss.
 12. The system of claim 11, wherein the threaded coolingapparatus further comprises a second seal configured to reduce orprevent coolant flow between the first and second cooling channels thatbypasses the heat exchanger.
 13. The system of claim 9, wherein thethreaded cooling apparatus comprises a bolt.
 14. The system of claim 9,wherein the first cooling channel extends along an entire length of theshaft.
 15. The system of claim 9, wherein the first cooling channelextends along part but not all of a length of the shaft and is angled sothat an entry to the first cooling channel is located along a side ofthe shaft
 16. The system of claim 9, wherein the second cooling channelcomprises a groove through at least part of the shaft.
 17. A methodcomprising: inserting a threaded cooling apparatus into a structure, thethreaded cooling apparatus comprising a head and a shaft, the headcomprising a heat exchanger, the shaft comprising a threaded sectionconfigured to mechanically fasten the head to the structure; providingcoolant to the heat exchanger through a first cooling channel in theshaft, the heat exchanger configured to exchange heat with the coolantflowing through the head; and exhausting the coolant from the heatexchanger through a second cooling channel in the shaft.
 18. The methodof claim 17, wherein during insertion the heat exchanger translatesperpendicular to a surface of the structure based on rotation of thethreaded cooling apparatus.
 19. The method of claim 17, wherein thethreaded cooling apparatus further comprises a first seal between thehead and the manifold, the first seal configured to reduce or preventcoolant loss.
 20. The method of claim 19, wherein the threaded coolingapparatus further comprises a second seal configured to reduce orprevent coolant flow between the first and second cooling channels thatbypasses the heat exchanger.